Abstract:

This study entails the modeling and examination of heat transfer concerning a heat sink on a Printed Circuit Board (PCB). The focus is on an elliptical fin configuration with integrated slits, and the analysis employs Ansys software to evaluate heat transfer dynamics. The utilization of elliptical fins aims to mitigate vortex-induced effects by minimizing pressure losses across the heat sink. This design, often manufactured through the extrusion of plate fins with strategically placed cross-cuts, can be further improved by employing a forging process to shape the fins into ellipses. In comparison to traditional plate fin heat sinks, the elliptical fin design demonstrates enhanced heat transfer efficiency in scenarios characterized by low airflow. Furthermore, when contrasted with Round Pin Heatsinks, the introduction of cross-cuts in the elliptical configuration results in a larger exposed surface area for improved heat dissipation. Particularly noteworthy is the outstanding performance of elliptical fins, capable of lowering temperatures from 350 K to 305 K for a 15W heat load. This configuration proves especially effective in applications involving parallel arrays of heat sinks. By facilitating a substantial airflow between adjacent heat sinks, the fins mitigate air blocking, thereby enhancing the circulation of cool air and optimizing overall ventilation.

Description:

Heat Transfer; Fins; Temperature; Velocity; AA 6063